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Protavic resins are used to protect, insulate and dissipate heat and to conceal circuitry, components and devices. These formulations were designed to satisfy the requirements of many demanding potting, encapsulating and casting applications in the electronic, electrical, automotive and aerospace industries. (read more)
Thermal compounds and thermal interface materials form a thermally conductive layer on a substrate, between components or within a finished product
IC interfaces are semiconductor chips that are used to control and manage the sharing of information between devices
Search by Specification | Learn MorePCMCIA bus interface cards translate data from a PCMCIA bus to another type of bus, and vice versa. They are used to connect two incompatible buses
Learn MoreElectrical resins and electronic compounds includes adhesives, greases, pads, stock shapes, tapes, encapsulants, potting compounds, thermal interface materials, and electrically conductive substances used in electrical, electronics, and semiconductor applications
Search by Specification | Learn MoreConformal coatings encapsulate circuit boards and their electronic components in order to prevent the ingress of moisture, fungus, dust and other environmental contaminants.
Search by Specification | Learn MoreThermal insulation and fireproofing materials reduce the flow of heat through the thickness of the material. They are typically fiber-based or foam structures prepared from thermally-stable materials.
Search by Specification | Learn MoreTouch screen displays are user-friendly input devices. The user touches the screen and the input is communicated directly to the computer.
Search by Specification | Learn MoreEncapsulants and potting compounds are resins or adhesives that are used to encapsulate circuit boards and semiconductors, fill containers of electronic components, and infiltrate electrical coils. They provide environmental protection, electrical insulation and other specialized characteristics.
Search by Specification | Learn MoreDielectric ceramics and substrates are electrical insulators with dielectric strength, dielectric constant and loss tangent values tailored for specific device applications.
Search by Specification | Learn MorePolyurethane adhesives and sealants provide excellent flexibility, impact resistance, and durability. They are available in one-part or two-part adhesive systems.
Search by Specification | Learn MoreNetwork and communication chips are semiconductor integrated circuits (IC) used in telecommunication devices and systems.
Search by Specification | Learn MoreConductive adhesives and compounds provide an electrically and/or thermally conductive path between components.
Search by Specification | Learn MoreFlat panel displays (FPDs) are thin, flat, electronic devices used to display data. They are commonly used in notebook computers. Most styles include the housing and ports necessary to connect them to a computer.
Search by Specification | Learn MoreThermoset adhesives are crosslinked polymeric resins that are cured using heat and/or heat and pressure. They are used for high load assemblies and in severe service conditions
Search by Specification | Learn MoreRubber adhesives and rubber sealants are highly flexible, natural or synthetic materials that are used to join components or fill gaps between seams or on surfaces.
Search by Specification | Learn More
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Thermal Products Protavic America, Inc.
Thermal Compounds and Thermal Interface Materials Thermal Solutions International, Inc.
Thermally Conductive, High Temperature Adhesive Master Bond, Inc.
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Palletiser/depalletiser Layer Master, an automation solution for depalletising and palletising unmixed layers (read more)
DRC Metrigraphics use a combination of process tools, high-resolution photolithography, thin-film coating, and micro-miniature 2-D and 3-D precision electroforming are combined to produce high density, multi-layer flexible circuits with 5-micron traces and spaces. (read more)
A combination of high-resolution photolithography, thin-film coating, and precision electroforming are combined to produce high density, multi-layer flexible circuits with 5 micron traces and spaces. (read more)
RCD Components Inc., a leading manufacturer of passive components, today expanded its highest capacitance range of its multilayer ceramic chip capacitor (MLCCs) Series CE. Their high-capacitance-value capacitors are available in capacitance values up to 100 microfarads in case sizes from 1210 to 0402, depending on the C/V value. (read more)
Eaton is proud to offer a new and easy way to interface, HMi. Available in 4", 6", 8" and 10" models, HMi is a true analog touchscreen (not touch cell like many devices) operator interface with programmable function buttons for even the most robust applications. (read more)
Maple Systems announces the release of a new generation of touchscreen OITs. Built on a high-function hardware platform, Silver Series Plus OITs are designed to meet the demands of today's industrial environments. The full-featured OITs take all of the features of the popular Silver Series & improve upon them with enhanced displays, better connectivity & improved data management. (read more)
Moxa's EDS-828 delivers the full-wired speed of Layer 3 switching and a redundant Gigabit backbone in a modular platform, making it suitable for critical network connections with high data transmission rates. Layer 3 switching helps organize and optimize your LAN segment choice, and upgrade flexibility is guaranteed with the interchangeable Gigabit and Fast Ethernet modules. (read more)
This high-power line of high-voltage regulated DC to DC converters is an extension of the "C" Series, directly addressing the high power density needs of >30 watt applications. High Power "8C-30C" units provide up to 60/125 watts. This high power density is especially suited to high energy systems with large capacitances, fast repetition rates, or high continuous-DC-power requirements. (read more)
The Silver Series Plus is an exciting line of graphic operator interfaces that build upon the versatility of the popular Silver Series. These touchscreen OITs offer additional hardware features such as larger displays, more memory, USB ports and enhanced CompactFlash and Ethernet support. (read more)
Fast Rise/Low Overshoot Capacitor Charging & DC Bias Power 0 to 8kV through 0 to 15kV @ 0 to 60 watts & 125 watts (read more)
| Part # | Distributor | Manufacturer | Product Category | Description |
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| 59K5831 | Newark | Analog Devices | Ceramic Multi-Layer | A/D Converter (A-D) Ic; Resolution (Bits):12; Input Channels Per Adc:8; Input Channel Type:Single Ended; Data Interface:Serial; Package/Case:24-Dip; Features:8 Channel, Serial, High Speed Data Acq. System; Inl :1Lsb Rohs Compliant: Yes |
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High-Definition Multimedia Interface - Wikipedia, the free... High-Definition Multimedia Interface From Wikipedia, the free encyclopedia High-Definition Multimedia Interface HDMI cable and HDMI official logo |
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PCI Express - Wikipedia, the free encyclopedia PCI Express was designed to replace the general-purpose PCI expansion bus, the high-end PCI-X bus and the AGP graphics card interface. |
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Cypress Semiconductor High-Brightness LED Solutions » EZ-Color?HB LED Controllers Backplane Interface & Clock Mgmt Clock Distribution See Cypress Semiconductor Corp. Information |
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Physical Review E Two different fluid phases separated by a solid region have been observed in the high α -... |
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NXP Semiconductors See NXP Information |
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Linux & Wireless LANs Symbol Spectrum24 High Rate (802.11b), 3Com AirConnect, Intel PRO/Wireless and Socket Communication |
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The devices, the drivers Except in a few case, you need a driver to interface you wireless network device to the Linux kernel. |
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D-Link | Welcome Construction Services Firm Solves Connectivity and Large File Printing Issues with D-Link Layer 2 and Layer 3 Switches See D-Link Systems, Inc. Information |
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SCIzzL Overview about the new SCI book: SCI: Scalable Coherent Interface, Architecture and Software for High-Performance compute Clusters, compiled by Hellwagner and |
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AMCC - Physical Layer Devices - Framer/Mapper See Applied Micro Circuits Corporation Information |
